View cart “MOSLED EXTREME ( mosX ) ceramic insulation 3XV 4040 triple MCPCB 20mm” has been added to your cart.

MOSLED EXTREME ( mosX ) ceramic insulation 7070 MCPCB 20mm

2.47 1.77

    • 0.5 €
    • 0.2 €
Categories: ,


These very high performance metal core PCBs except for LEDs, also have footprints for external power MOSFET  and NTC temperature sensor on single board, and they are compatible with LD-B4(HV) driver. MOSFET on such MCPCB has best possible thermal contact with flashlight body, so it can dissipate a lot of power without overheating, which is very important when driving modern low Vf LEDs like Luxeon V, SST-40, Nichia 219C, CREE XP-G3, XP-L2,XHP-35,HXP-50.2,XHP-70.2…

mosX PCBs are made from aluminum with chemically grown aluminum oxide ceramic (alumina) as insulation layer, which is excellent thermal conductor compared to even best classical MCPCB insulation layers (epoxy+ ceramic powder).

Advantages over copper DTP are:

  • electrically insulated – it’s possible to use LEDs with electrically non-insulated thermal pad,like OSRAM Oslon (IR,white), while maintaining DTP – like performance
  • very flat surface – this is important for very small LED packages
  • lower mass – may be beneficial in headlamps
  • higher temperature insulator resistance – because there are no laminated epoxy based layers, ceramic insulator cannot be damaged due to excessive heat


Note 1: Due to very high thermal conductivity on whole board area, soldering wires is more challenging; one simple solution is to preheat PCB with hot air or with soldering iron (by holding iron tip on + or – pad) and then solder wires. During soldering, PCB must be thermally insulated(piece of thick paper is good enough) from any thermally conductive objects.

Note 2: White dot marks close to LED footprint represent LED cathode!

Note 3: MOSLED boards can be also used as normal MCPCBs without MOSFET, in that case MOSFET footprint should be shorted with metal/0 Ohm jumper.

  • 7070 footprint (CREE XHP-70,XHP-70.2)
  • compatible with LD-B4(HV) driver
  • Aluminum oxide ceramic insulation layer – extremely low thermal resistance
  • Aluminum core – 3.3 times lighter compared to copper PCBs (1.25grams)
  • Power MOSFET footprint, 0402 NTC sensor fooprint on board (1-wire NTC connection support)
  • 70um copper traces
  • Gold plated contacts
  • Milled edge – flat bottom side
  • Diameter: 20.0±0.15mm
  • Thickness: 1.5mm


Additional information

Weight 0.00127 g