LD-B4HV 2-12Amp 2S/4S multi-cell 17mm constant current LED flashlight driver (external MOSFET support)

15.97 11.97

Out of stock


Datasheet download: LD-x4 datasheet v1.1

LD-B4HV  2-12A constant current („PWM-less“) LED driver is high-voltage variant of LD-B4 linear driver designed for 2S(8.4V) or 4S(16.8V) operation.

LD-B4HV is designed to work with external power MOSFET (source of heat) for much higher power dissipation – up to 15W@60C, which makes it perfect for driving any 6V, 9V or 12V multi-die LEDs like CREE XHP50, XHP70, XHP50.2, XHP70.2, XHP35 HD, XHP35 HI, Luxeon M or MZ (6V,12V variants) or for driving discrete 3V LEDs connected in series.

“MOSLED EXTREME” high performance metal core PCBs have space for MOSFET and NTC sensor, which makes 6-12V LED high power builds fast and easy, and more important – reliable because of real constant current driving/limiting.

Because current on all modes is regulated, LD-B4HV driver series is ideal solution for driving modern LEDs with very low Vf (especially XHP50.2,XHP70.2, XHP35, Luxeon M/MZ) from 2S/4S  li-ion battery cells/pack, and because of external MOSFET support there are no problems with heat dissipation.

Hardware features:
  • True PWM-less constant current (all modes)
  • Available as 3, 6, 9 and 12Amps version – 2-12Amps possible by adjusting current in UI
  • Completely silent – no acoustical or EMI noise („whining“)
  • Longer run-times on lower modes compared to PWM drivers
  • Higher overall lm/W efficiency on lower modes compared to PWM drivers
  • Lower losses in springs, wires, switch compared to PWM drivers
  • Very low internal resistance comparable to best DD drivers
  • Hardware DD mode option on high mode without current limit
  • Calibrated internal voltage reference and temp. sensor
  • Dual over-temperature protection (internal, and external [NTC] sensor) – 2-wire NTC connection
  • Low sleep current
  • Improved Off-time mode memory circuit
  • Low current (1mA) bleeding support for illuminated tailcaps
  • Single-sided PCB with large (9mm) spring pad on bottom side
  • 4-layer gold plated PCB
  • Lead free
User interface features:
  • 2-level depth configuration menu with back/cancel option – possibility to change many settings without leaving configuration mode
  • Adjustable current (without any resistor change):                                                                                                                                                                                                                                                     0.125Amp steps (3A version) down to 2A;                                                                                                                                                                                                                                                            0.250Amp steps (6A and 9A version) down to 4A (6A version) and                                                                                                                                                                                                                                 7A (9A version):0.500Amp steps (12A version) down to 8A
  • 1-5 modes mode – groups
  • Mode memory Enable/Disable
  • CC/DD Enable/Disable for high. mode (Constant current/Hardware Direct Drive)
  • Mode order Forward/Backward
  • 2x or 3x tap special function – Tactical strobe/High mode/Disable
  • External over-temperature(OTP) threshold setting – Factory/Custom/ Disable
  • Configuration mode password Enable/Disable
  • Factory reset
Electrical characteristics:
  • Input voltage: 2S version (5.6V – 8.4V), 4S version (11.2V – 16.8V), 3S available on request
  • Output current: 2-12 Amperes (3A,6A,9A,12A default options)
  • Switch type supported: reverse clicky switch
  • Internal resistance: 5mΩ@3.7V
  • Average efficiency(Vf=3V/cell):      85%
  •                                 ( Vf=3.4V/cell):  90%
  • Sleep/off current: 2S: 40uA typ. (65uA typ. with ext. NTC sensor) /1mA with low current bleeding
  •                                  4S: 55uA typ. (80uA typ. with ext. NTC sensor) /1mA with low current bleeding
  • Active state (operating) current: 1.6mA typ. (2.6mA typ. with low current bleeding)
  • Tailcap bleeding current consumption: 1.0mA typ.
  • Driver internal OTP protection threshold: ~105°C
  • Default external sensor OTP threshold: ~65°C
  • Step 1 LVP threshold: 3.0V/cell (restricted power)
  • Step 2 LVP threshold: 2.8V/cell (shutdown)
  • Configuration menu level 1 (main menu) current: 350mA (175mA for 3A version)
  • Configuration menu level 2 (sub-menus) current: 90mA   (45mA for 3A version)
Mechanical characteristics:
  • Driver diameter: 17.00±0.15mm
  • Thickness: 2.5±0.15mm
  • LED wire pads hole diameter: 1.3mm
  • Spring pad diameter: 9.15mm
  • Number of el. components on PCB (top side only): 26
Important note: differences compared to LD-B4(1S version)
  • LD-B4HV has no reverse polarity protection – please be careful when inserting batteries
  • LD-B4HV currently has no moonlight mode enabled (this feature should be available in next revision after hardware upgrade)
  • LD-B4HV requires 2-wire NTC connection: one wire should be soldered to left side of large ceramic capacitor, other wire pad is at the same location as on LD-x4
  • NTC on mosX MCPCBs should be soldered only on single pad (that is connected to “T” pad od pcb), on the other NTC side 2nd wire should be soldered directly


Signal wires option explanation:

LD-B4 -4x 20cm 30AWG silicone wires:

  1. White color x2 – for NTC external overtemp. protection sensor (optional feature)
  2. Yellow or blue color – for Gate signal connection between LD-B4 pcb and MOSLED MCPCB (mandatory)
  3. Red color – for moonlight mode signal connection between LD-B4 pcb and MOSLED MCPCB(optional, needed if moonlight mode is enabled)


Additional information

Weight 2.0 g